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Very good tutorial on the use of solder bumpong on wafers.
Quick overview of techniques, diagrams, materials, and advantages/disadvantages of various bonding methods. Chipscale and Flip Chip Made Easy
Very nice paper from 1998.
Very comprehensive and detailed. Covers assembly methods, processes, equipment, etc.
Pdf Slide show on types and materials used for semiconductor ICs.
Lists pinouts for thousands of ICs.
Click on images for more information on these text books.
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